RVC to collect 200 applications in the project enabling search for start-ups in dual technologies
https://en.generation-startup.ru/media-center/news/39820/?id=56
Address:
8, Presnenskaya emb., Moscow, 123112
Search
13 October 2017

RVC to collect 200 applications in the project enabling search for start-ups in dual technologies

Dual Technologies project of the start-up accelerator GenerationS from the Russian Venture Company (RVC) has already collected about 200 applications in the field of technologies for the military and civil industries, reported Vladislav Fedotov, a counsel of the RVC CEO, in an interview to RIA News.

Dual Technologies project of the start-up accelerator GenerationS from the Russian Venture Company (RVC) has already collected about 200 applications in the field of technologies for the military and civil industries, reported Vladislav Fedotov, a counsel of the RVC CEO, in an interview to RIA News.

“Dual Technologies” track collects developers of solutions in the field of technologies for military and civil industries. The promising projects can be included in the portfolio companies of the RVC subsidiary funds and receive investments from the track partners: Voentelecom, Roselectronics and Aviation Complex n.a. Ilyushin. Applications are welcome from September 1, and application submission phase will last till November. 1. It is expected to collect about 300 applications in total. Track final is scheduled to April-May 2018.

On October 16-18, the Open Innovation forum will be held in Moscow, the main subject of which is "Digital economy. Global transformation challenges”. MIA "Russia today" is a general information partner of the forum. RVC participates in this event.

"As of today, about 200 applications have been submitted. There are quite a lot of projects related to the new technologies in the field of power energy, technologies of production of the inventory materials, there are also some promising projects in the field of robotics and unmanned aircraft. For example, four projects within the framework of the International forum "Microelectronics 2017" including the projects in the field of distributed data, information protection and analysis", said Fedotov.

"The industry mandate is quite wide and stronger variability of applications submitted confirms that the interindustry focus is more than demanded today and sparks interest among the industrial partners", he added.

The applications are accepted within the track in eight investment directions: big data; new and portable energy sources; new manufacturing technologies; sensorics and robotics components; wireless connection technology; technology for management of biological object properties and cognitive technologies; artificial intelligence; neuro technology and virtual and additive reality technology.

Source: RIA News

You have successfully subscribed!
Keep me posted!
Signing up to our project's newsletter you agree to the Terms of Use